Most Read Articles – Arm IPO, Intel Foundry Services, US Chips Act


What topics are covered this week? There’s a pair of Chips Acts (for EU and US), Arm’s proposed IPO, Intel Foundry Services, and a engineer in wonderland blog on strong polymers…

5. EU launches flea law
EU President Ursula von der Leyen launched the $48 billion EU chip law this afternoon. The law aims to rival the US’s $52 billion Chip Act in a bid to quadruple EU IC production over the next eight years and secure a 20% global market share for the ‘Europe. $48 billion in a year alone seems small compared to the Big Three’s capital budgets of $40 billion a year. The source of funding for the law’s proposals is under discussion as the EU budget has already been allocated until 2027. It appears that only €5 billion – or 15% of the budget – comes from direct funding of the EU and the rest must be recovered from the expenditure already allocated.

4. Arming for IPO after Nvidia bid failed [Mannerisms]
RIP Nvidia-Arm, thank goodness. It always felt like a brazen sort of bidding – something the bidder saw as fluttering with no serious hope of success. For Jen-Hsun Huang, however, who gobbled up $150 million selling shares during the deal, the exercise can’t quite be called a failure. However, the intellectual effort to justify the proposed deal was pitiful. Any schoolgirl could have produced better justifications for the merger than those offered by Nvidia and Arm. To suggest that Arm – an IP company for god’s sake – wouldn’t be able to pay its R&D budget without Nvidia was insulting. To suggest that Nvidia, a long-time licensee of Arm, needed to buy Arm before Arm and Nvidia could co-design a chip to attack the data center market is foolish.

3. Alphawave, Analog Bits and Siemens Digital sign for Intel Foundry Services
Analog Bits, Siemens Digital Industries Software and Alphawave partner with Intel Foundry Services (IFS). Siemens Digital Industries Software has become a founding member of the Intel Foundry Services (IFS) Accelerator – EDA Alliance, a program committed to establishing an ecosystem for the design and manufacture of next-generation SoCs fabricated on IFS processes. The initiative promotes collaboration between IFS and its ecosystem partners, with a focus on reducing risk and removing design barriers while accelerating joint customer products to market. IFS Accelerator – EDA Alliance partners gain early access to Intel’s process and packaging technologies, allowing them to co-optimize and improve tools and workflows.

2. This polymer “stronger than steel” [Engineer In Wonderland]
The polymers inside what we call plastics are long, thin, tangled molecules – so one-dimensional molecules. Scientists at MIT have succeeded in making a two-dimensional polymer, which lays down in sheets glued together much like graphene. The material, dubbed 2DPA-1, has a 2D modulus of elasticity of about 12.7 GPa and a yield strength of about 488 MPa, leading MIT to say they are “between four and six times that of bulletproof glass” and “twice that of bulletproof glass”. steel, even though the material only has about one-sixth the density of steel,” respectively. “Such a material could be used as a lightweight, durable coating for car parts or cell phones, or as a construction material for bridges or other structures. Another key feature of 2DPA-1 is that it is waterproof. to gases.

1. The United States (sort of) passes the Chips Act
The US flea law passed the House of Representatives on Friday by a margin of 222 to 210. Now follows a period as the Senate and House seek to reconcile the differences between their two versions of the bill. The combined version will then have to be voted on again to become law. If passed, the law will provide $52 billion for semiconductor investment. The bill, as it currently stands, would establish a director of manufacturing role within the executive branch of the White House and create nearly a million additional apprenticeships over the next five years. .

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