Most read articles – Infineon IGBT, Tesla records, 28nm ReRAM


What are the topics covered this week? There’s the size of the GaN power device market, Tesla ignoring chip shortages, Infineon’s automotive-rated 50kW IGBT half-bridge for electric and hybrid vehicles, the advanced packaging market, and ReRAM technology in a 28nm process.

5. Navitas is a leader in the delivery of GaN power devices
Annual GaN power device revenue for 2021 will reach $ 83 million, a 73 percent year-over-year increase, according to TrendForce. Navitas is expected to achieve a 29% market share (measured by total shipping) and overtake Power Integrations (PI) for the top position this year. Thanks to Navitas’ proprietary GaNFast power integrated circuit design and excellent relationships with its semiconductor supply chain partners, it has become the largest supplier of GaN power integrated circuit chips in the markets. consumer electronics.

4. Tesla ignores shortage of chips to ship record car numbers
While the auto industry expects to lose 7.7 million vehicle sales at a cost of $ 210 billion, Tesla ignored chip shortages to deliver a record number of cars in the third quarter. Tesla has handled the chip supply better than the rest of the auto industry. Sales have increased quarterly for six successive quarters. Q3 sales increased 20% from Q2 and 73% year-on-year, totaling 241,300 vehicles. 232,025 Model 3 and Model Y SUV cars were sold and 9,275 Model S and Model X cars were sold.

Infineon EasyPACK_2B_EDT23. 750V electric vehicle IGBT module manages 50kW
Infineon has introduced an automotive-qualified 50 kW IGBT half-bridge for electric and hybrid vehicles. Called FF300R08W2P2_B11A and rated at 230 Arms, it includes a pair of 750 V IGBTs from the company’s EDT2 generation, optimized for 10 kHz switching. “The chipset has a benchmark current density combined with short circuit robustness for reliable UPS operation under harsh environmental conditions,” said Infineon.

2. Advanced packaging market to be worth $ 47.5 billion in 2026, says Yole
The advanced packaging market is expected to more than double its revenue between 2014 and 2026, according to Yole Développement (Yole) which forecasts a market of $ 47.5 billion in 2026, with a 2014-2026 CAGR of 7, 4%. The share of advanced packaging in the total semiconductor market is continuously increasing and is expected to reach nearly 50% of the market by 2026. The highest revenue CAGRs are expected from 3D stacking, ED and Fan-Out, at 22%, 25% and 15% respectively between 2020 and 2026. Heterogeneous integration is considered to increase the value of a semiconductor product, add functionality, maintain / increase performance while reducing costs. costs.

1. Weebit Nano ReRAM scaled to 28nm
Weebit Nano and CEA-Leti demonstrated the production level parameters of Weebit’s ReRAM technology in a 28nm process. Demonstrating the production level parameters of Weebit’s 28nm ReRAM technology is a key step towards the production of on-board non-volatile memory (NVM). Weebit and CEA-Leti jointly tested, characterized and measured 1 megabit (Mo) ReRAM functional matrices in 28nm processing technology on 300mm wafers.

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